ADVANCE ESSENTIAL MATERIALS
and
SUSTAINABLE SOLUTIONS
Advance Essential Materials and Sustainable Solutions For ferroelectric, piezoelectric devices, semiconductor films, high-k capacitors, energy harvesting & storage devices, sensors, MEMS & other functional devices.
- Electrodes
- Chemical Coating Solutions
- Nano-powders & Pastes
- Polymer Films
- Foundry Processing Services
Advance Essential Materials and
Sustainable Solutions Products
&
Structured Substrates
for Electronics
&
Conductive Metal Foil
Foundry
Services
Solution
Deposition
Services
(PZT Solutions)
&
Structured Substrates
for Electronics
Platinum Electrodes And Structured Substrates For Electronic
Platinum Electrodes and Structured Substrates for Electronic thin films are widely used botton electrode for Si-based electronic devices because of its high thermal conductivity & good stability in oxidizing atmospheres. The Pt wafers have thermal stability, which guarantees excellent performance of electronic devices including MEMS.
Platinized Si Wafers
- Pt film thickness : 50 nm ~ 300 nm
- Adhesion layer : Ti, 10 nm ~ 20 nm
- Substrates : SiO2 /Si wafers, SiO2 /SOI wafers
- Size : Sample size ~ 6 inches
- Orientation : (111)
- FWHM : ~ 2° (depends on substrate)
- Temperature endurance : ~ 800°C
- Roughness (Rms) : ~ 1.5 nm
Metal Coating Services
- Pt, Au, AL, Ti, Mo, Ta, Cr, Cu, Ni, NiCr etc.
- Substrate & Film thickness : As per customer requirements
Structured Substrates For Piezo-MEMS Devices
- Pt/Ti/SOI Wafer
- Pt/Ti/LTO/Si3N4 /(SiO2)/Si Wafer
- Others
| Products ( 6 inch Standard) | Quantity |
| 1. Platinized Si wafer (6 inch, Standard) – Orientation of Pt: (111) – Thickness of Pt: 150 nm – Adhesion layer: Ti, 10~20 nm* Substrate: SiO2/Si– SiO2: (dry) thermal oxide, 300 nm– Si: 6 inch, p-type, Prime, SSP, <100>* Film structure: Pt/Ti/SiO2/Si | 1 |
| 2. Platinized Si wafer (4 inch) | 1 |
| 3. Pt coating (user wafer) | 1 |
| 4. 4 inch Pt coating (user wafer) | 1 |
| 5. Top Pt electrode (150 nm) | 1 |
&
Conductive Metal Foil
Wafer And Conductive Metal Foil
Wafer and Conductive Metal Foil
- Si Wafer
- SOI Wafer
- Metal Foil
Characteristics of Metal Foil Substrates
- Thickness : ~ 25 µm
- Flexibility, High strength
- High corrosion resistance
- Bio-compatible
- High temperature ~ 7000C
- Good machinability & conductivity
Foundry
Services
MEMS Foundry Services
MEMS Foundry Services SURFACE & BULK MICROMACHINING PROCESS
| Process | Equipment | Notes |
| Photolithography | Spin Coater & Track System | Sample ~ 8 inch |
| Photolithography | Mask Aligner | Sample ~ 6 inch |
| Photolithography | Wet Station & Spin Dryer | |
| Photolithography | Plasma Asher & Cleaner | |
| Chemical Vapor Deposition | PECVD | Poly Silicon, SiO2, Si3N4 |
| E-beam Lithography | E-beam Evaporator | 4~8 inch/Au, Cu, Al etc. |
| Dry Etcher | DRIE & ICP Etcher | Si, Oxide & Metal film etch |
| Dry Etcher | Ion Beam Etching System | 4~8 inch |
| Oxidation | Diffusion Furnace | 2~8 inch |
| Others | SAM & AAO System | |
| Others | Dicing Saw | |
| Others | Electro-plate machine | |
| Others | Anodic Bonder, Bonding Aligner & Wire Bonder | |
| Others | Grinding & Polishing Machine |
Solution
Deposition
Services
Chemical Solution Deposition Services
Chemical Solution Deposition Services – COATING SERVICE (SOLUTION COATING)
| Products (6 inch standard) | Quantity | ||
| PZT | ~300 nm coating | 6 inch | 1 |
| PZT | 300 ~ 600 nm coating | 6 inch | |
| PZT | 600 nm ~ 1µm coating | 6 inch | |
| PZT | ~2 µm coating | 6 inch | |
| PZT | ~3 µm coating | 6 inch | |
| PZT | ~5 µm coating | 6 inch | |
| PZT | ~1 µm coating | 4 inch | 1 |
| PZT | ~2 µm coating | 4 inch | 1 |
| PZT | ~3 µm coating | 4 inch | 1 |
| Lead-free | ~500 nm coating | 6 inch | 1 |
| Lead-free | 600 nm ~ 1 µm coating | 6 inch | 1 |
| – Sample size (2 inch): Manual progress → 1/2 amount applied to 6 inch standard amount – Sample size (4 inches): Manual progress → Unable to proceed due to substrate alignment problem – Manual progress for 2 inches and 4 inches → Backside contamination – Comes with basic data such as XRD and P-V Curve |
PZT & Lead-Free THIN FILM COATING SERVICES
- Composition: As per customer including dopants
- Target thickness : 100 nm ~ 5 µm
- Substrate size : Sample size ~ 6 inches
- Standard substrate : Pt/Ti/SiO2 /Si
Pt/Ti on SOI Wafer
Other MEMS structured Wafers - Basic data & process flow chart will be provided
(PZT Solutions)
Chemical Coating Solutions -Piezoelectric & PZT Nano Powders
Piezoelectric PZT Nano powder & Chemical Coating Solutions of PZT are used above all for synthesis of the dominant piezoelectric material system used in variety of transducers, actuators as well as sensors due to the ion efficiencies.
The PZT sol-gel solutions 0.4M, 0.7M as well as Lead-free sol-gel solution 0.4M are offered by us, as well as LNO, LiCoO3 as well as ZnO solutions as well as others.
All the more, the lead free PZT Nano powder in purity of above 99.5% as well as Lead Zirconate Titanate powder in less than 100 nm size are available.
Besides, we also usually offer lead-free sol-gel solutions which are KNN or BKNT based.
Secondly, we offer MULTICOMPONENTS CHEMICAL SOLUTIONS suitable for dielectric, semiconductor, conductor, thermoelectric as well as functional oxides.
Consequently, materials used are simply BaTiO3, (Ba,Sr)TiO3, ZnO-based multicomponent, (La,Ni)CoO3-based p-type, La(Ca, Mn)O3-based n-type as well as Bi-based pyrochlore. Above all, we also offer single component chemical solutions of, as an example, Al2O3, TiO2, ZrO2, SiO2, ZnO for dielectrics & functional oxides.
IN PARTICULAR, WE OFFER PZT SOLUTIONS & NANO POWDER – 100 Ml BOTTLES
Other materials that can be made: LNO, LiCoO3, ZnO etc
20% additional cost of base amount if dopants La, Ca, Sr, Nb are added.
The Composition of (Zr/Ti ratio), excess PbO content can be changed as desired.
Consulting with customers for doping concentration.
Provision of basic data and process diagrams.
PZT SOL-GEL SOLUTION ADVANTAGES
- Thickness per one layer : 12 nm ~ 300 nm ( as per molar ratio)
- Precise composition control : Pb & Zr/Ti Ratio : Within +/- 2%
- Easy dopant addition: La, Ca, Nb, Sr or as per customer requirements
- Reproducibility -Excellent
- Excellent electrical properties
LEAD-FREE SOL-GEL SOLUTION ADVANTAGES
KNN or BNKT BASED
- Thickness per one layer : 50 nm ~ 100 nm ( as per composition & molar ratio)
- Precise composition control
- Easy dopant control
- Excellent reproducibility
- Excellent electrical properties
- Can provide CSD process flow
- NON-TOXIC SOLVENT
- BIOCOMPATIBLE
MULTICOMPONENTS CHEMICAL SOLUTIONS
For dielectrics, semiconductors, conductors, thermoelectric oxide & functional oxides
- Materials : BaTiO3, (Ba,Sr)TiO3
ZnO-based multicomponent
(La, Ni)CoO3-based p-type
La(Ca, Mn)O3-based n-type
Bi-based pyrochlore - Customized materials
- Solution concentration : 0.1 – 0.4 mol/L (10-100 nm/layer)
- Solvents : 2-methoxyethanol, methanol, ethanol or other alcohols as per customer requirements
- Can provide CSD process flow
- Other customized materials
SINGLE COMPONENT CHEMICAL SOLUTIONS
As an example for dielectrics & functional oxides
- Materials : Al2O3, TiO2, ZrO2, SiO2, ZnO
- Customized materials
- Solution concentration : 0.1 – 0.4 mol/L (10-100 nm/layer)
